Programme

/Programme
Programme 2017-12-22T13:45:41+00:00

Programme

LPM 2018 will feature oral and poster presentations from worldwide experts. During the four-day event, there will be multiple sessions on topics ranging from micro laser joining, through surface engineering and laser ablation, drilling, cutting and micro fabrication.  The latest developments in ultrashort pulsed laser processing, systems, ancillaries and applications will be presented.