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Programme

/Programme
Programme 2017-09-04T11:31:19+00:00

Programme

LPM 2018 will feature oral and poster presentations from worldwide experts. During the During the four-day event, there will be multiple sessions on topics ranging from micro laser joining, through surface engineering and laser ablation, drilling, cutting and micro fabrication.  The latest developments in ultrashort pulsed laser processing, systems, ancillaries and applications will be presented.

You are invited to submit an abstract for an oral or a poster presentation.

  • Abstract submission opens November 2017
  • Abstract submission closes January 2018

Watch this page for more details